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RXN Tin (Sn) FAQ - Q uestion and A nswer Table of Contents:
| Q | 1. How can solderability be maintained on tin? |
| A | Tin plating on a component improves its solderability, but this improved solderability has a shelf life. AMP Incorporated has presented a technical article on this subject. |
| ^ |
Return to Tin (Sn) FAQ Table of Contents
|
| Q | 2. How can tin whiskering be prevented? |
| A | Filimentary corrosion (whiskering) of tin under electrical or mechanical bias and humidity has traditionally been countered with the addition of 2%-7% lead. AMP Incorporated has presented a technical article on lead-free tin whisker control. |
| ^ |
Return to Tin (Sn) FAQ Table of Contents
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DISCLAIMER: This FAQ is provided as is without any expressed or implied warranties. While every effort has been taken to ensure the accuracy of the information contained in this FAQ, the maintainer assumes no responsibility for errors or omissions, or for damages resulting from the use, or misuse, of the information contained herein.